The Reliable Software Developers’ Conference – UK, May 2014

Technology event organiser Energi Technical has announced that it will be launching "The Reliable Software Developers' Conference", scheduled for May 2014.

This one-day conference will provide an important forum for engineers and developers working in the development of safety critical systems and high availability systems. It is expected to attract software developers working in such industries as automotive, railway systems, aerospace, banking, medical and energy. www.rsd-conference.co.uk

"In recent years, software has become so complex that ensuring safety and reliability is now a major challenge," said Richard Blackburn, Event Organiser. "Many systems now have millions of lines of code and will handle enormous amounts of data. Further to this, modern computer based systems will make millions of decisions every second and also have to be immune to interference and unpredictable events. This event will look at the MISRA coding standards, debug tools and software testing tools that are available to assist software programmers and engineers seeking to develop reliable and safety critical
systems."

The Reliable Software Developers' Conference will be co-located with the 2014 UK Device Developers' Conference. Both will be a one-day conference to be run in Bristol, Cambridge, Northern England and Scotland on May 20th, May 20rd, June 3rd and June 5th.

Delegates attending either event will have the opportunity to sit in on technical presentations and ½ day technical workshops and a attend a vendor exhibition of tools and technology for the development of real-time and embedded systems. www.device-developer-conference.co.uk

"Advanced Debug Tools, Code Test, Version Control, Verification Tools and Software Standards have been a growing feature of recent conferences, so it made sense to create a dedicated event," said Richard. "There will be a lot expertise available to delegates, and the chance to meet a broad range of vendors of test technologies and tools, all under one roof."

Developed in collaboration with MISRA (Coding Standards), the Reliable Software Developers' Conference will feature a number of presentations in the morning, followed by a half-day technical workshop in the afternoon. The presentations will be free and open to delegates of both Conferences, but the half-day workshops will be subject to a charge of £75. Delegates will learn about developments in coding standards, test and verification tools and best practices and it will also be an opportunity to meet with many industry experts.

Refer to：http://embedded-computing.com/news/the-uk-may-2014/

Acrosser wish you Happy Holidays and a very prospective 2014 coming soon!

As we near the end of 2013, Acrosser would like to send you our warmest New Year’s wishes! We wish you and your family health, comfort, and prosperity this holiday season.

We also thank you for keeping up with our latest products, sending us inquiries, and choosing our products for your integrated solution! In 2014, we hope you will continue to choose Acrosser. We look forward to assisting you and your company in becoming the leader in your vertical market, and building a win-win relationship together.

And don’t forget about our star product, AES-HM76Z1FL, and its upcoming Product Testing Event in January! Remember to mark your calendar, since Acrosser is lending the product for free only to selected participants! Please stay tuned for more event information in early January!

With your continuous dedication and our commitment to quality, Acrosser is always motivated to make your embedded idea a reality!

Product Information:
http://www.acrosser.com/Products/Embedded-Computer/Fanless-Embedded-Systems/AES-HM76Z1FL/Intel-Core-i3／i7-AES-HM76Z1FL.html

Contact us：
http://www.acrosser.com/inquiry.html

Comprehensive customization for network appliances: meet our rackmount and micro box!

acrosser Technology, a world-leading network communication designer and manufacturer, introduces two network appliances that deliver great performance and protection while simplifying your network. Each product has its own target market and appeals to a unique audience.

Acrosser’s ANR-IB75N1/A/B serves as an integrated Unified Threat Management (UTM) device that covers all of your networking security needs. Featuring a 3rd generation Intel Core i processor, increased processing throughput is easily made. For integration with information security systems, the device also features functions such as anti-virus, anti-spam, fire wall, intrusion detection, VPN and web filtering, in order to provide complete solutions to meet the demands of various applications.

Key features of the ANR-IB75N1/A/B include:
‧Support for LGA1155 Intel® Core ™ i7/i5/i3 processor / Pentium CPU
‧Intel B75 Chipset
‧2 x DDRIII DIMM, up to 16GB memory.
‧2 x Intel 82576EB Fiber ports
‧8 x Intel 82574L 10/100/1000Mbps ports
‧Two pairs LAN ports support bypass feature (LAN 1/2 + LAN 3/4)
‧LAN bypass can be controlled by BIOS and Jumper
‧CF socket, 2 x 2.5” HDD, 1 x SATA III, 1 x SATA II
‧Console, VGA (pinhead), 2 x USB 3.0 (2 x external)
‧Support boot from LAN, console redirection
‧Equipped with 80 Plus Bronze PSU to decrease CO2 dissipation and protect our environment
‧LCM module to provide user-friendly interface
‧Standard 1U rackmount size

As for our micro box, the AND-D525N2 provides more possibilities for different applications due to its small form factor (234mm*165mm*44mm). Aside from its space-saving design, the other 3 major features of the AND-D525N2 are its high performance, low power consumption and competitive price. Please send us your inquiry via our website (http://www.acrosser.com/inquiry.html), or simply contact your nearest local sales location for further information.
Key features of the AND-D525N2 include:
‧Intel Atom D525 1.86GHz
‧Intel ICH8M Chipset
‧x DDR3 SO-DIMM up to 4GB
‧1 x 2.5 inch HDD Bay, 1 x CF socket
‧4 x GbE LAN, Realtek 8111E
‧2 x USB2.0
‧2 x SATA II
‧1 x Console
‧1 x MiniPCIe socket

Besides In addition to these two models, Acrosser also provides a wide selection of network security hardware. With more than 26 years of rich industry experience, Acrosser has the ODM/OEM ability to carry out customized solutions, shortening customers’ time-to-market and creating numerous profits.

For all networking appliances product, please visit:
http://www.acrosser.com/Products/Networking-Appliance.html

Product Information – ANR-IB75N1/A/B:
http://www.acrosser.com/Products/Networking-Appliance/Rackmount/ANR-IB75N1／A／B/Networking-Appliance-ANR-IB75N1／A／B.html

Product Information – AND-D525N2:
http://www.acrosser.com/Products/Networking-Appliance/MicroBox/AND-D525N2/ATOM-D525-AND-D525N2.html

Contact us：
http://www.acrosser.com/inquiry.html

INDUSTRIAL ETHERNET GROWING

December 5, 2013 - The Chinese market for industrial Ethernet & Fieldbus Technologies grew by 18 million nodes in 2012. More than 3 million nodes used Ethernet and the remainder used Fieldbus technology.

Although Fieldbus has a large base of new connected nodes in China, the usage of Fieldbus is not as common as in developed countries such as Germany or the United States. This is mainly because Chinese customers are encountering networking technology much later than those developing countries.

However, the growing speed of Ethernet is quite considerable in China and we think it is a great opportunity for Chinese customers to upgrade their automation system under current market condition. Customers will just jump from old Fieldbus Technologies direct to Ethernet now and actually many of them are doing right now.  The Chinese market is currently engaged in extensive upgrading and new infrastructure construction, and that will require a great deal of Ethernet applications.

In China, international brands are quite influential. This is also true for industrial networking protocols because most of them having their supporting companies. For example, the most popular Fieldbus protocols in China are PROFIBUS and CC-Link, which are developed and promoted by Siemens and Mitsubishi separately, which command large market share in China.

On the other hand, some open protocols also have a large number of nodes connected, and the most representative ones are CANOpen, Modbus and HART. However, all three protocols don’t deliver strong functionality, and they are more likely to be used in low-end applications for easy connections.

With the upgrading of old facilities and the construction of new plants in China, customers also are being compelled to upgrade their systems using Ethernet. However, this move will not only be implemented by the customers, but also by the industrial automation vendors as well.

Most protocols have Ethernet variants. Because of this, many Fieldbus users will turn to the Ethernet of the application, for example, PROFIBUS to PROFINET, CC-Link to CC-Link IE. And the new automation products will also support those new Ethernet connections.

refer to:http://www.automation.com/portals/industrial-networks-field-buses/industrial-ethernet-growing-in-china

High Computing Performance for All Applications- F.I.T. Technology

The demand for computing performance in the IPC market continues to become stronger as the IT field advances. Acrosser’s new AES-HM76Z1FL has been designed to meet these demands.

The F.I.T. Technology used to build this new product reflects its 3 major features: fanless design, Intel core i processor and ultra thin frame. The fanless design not only reduces the risk of exposure to air dust, but also prevents fan-malfunction. With a height of less than 0.8 inches, AES-HM76Z1FL’s slim design makes itself FIT into every application.

As its structure and output interface show, AES-HM76Z1FL provides a wide range of choices, from HDMI, VGA, USB, and audio to GPIO output interfaces that suit almost all industries. For wireless communication needs, the AES-HM76Z1FL has a mini-PCle expansion slot which provides support on both 3.5G and WiFi.

Another fascinating feature of the AES-HM76Z1FL is its ease of installation for expansions. By disassembling the bottom cover, expansions such as CF cards, memory upgrades and mini-PCIe can be easily complete without moving the heat sink. Moreover, Acrosser adopts 4 types of CPU (Intel Core i7/i3, Intel Celeron 1047UE/927UE) for AES-HM76Z1FL, allowing it to satisfy the scalable market demands of different applications.

In conclusion, the AES-HM76Z1FL is truly a well-rounded product designed for diverse applications. To promote our star product AES-HM76Z1FL, Acrosser will launch a product testing campaign starting in January, 2014. Acrosser will provide selected applications with the new AES-HM76Z1FL for one month, and it’s free! For more detailed information, please stay tuned for our press release, or leave us an inquiry on our website at www.acrosser.com!

Product Information:
http://www.acrosser.com/Products/Embedded-Computer/Fanless-Embedded-Systems/AES-HM76Z1FL/Intel-Core-i3／i7-AES-HM76Z1FL.html

Contact us：
http://www.acrosser.com/inquiry.html

Service Dynamics Products & Services

Over the last few years a number of automation vendors have announced various services including outsourced maintenance, system integration, manufacturing and business process consulting, and remote operations. I wonder if an automation vendor can continue to be effective as both a product company and services provider.

To clarify the difference, let’s start by defining what I mean by services and products. By providing services, automation vendors engage with customers to perform labor and knowledge intensive tasks that may include system design, engineering services, system integration, preventative maintenance, remote operations, and other services. By providing products, automation vendors sell something to the customers, system integrators and engineering firms that they will apply to accomplish automation tasks in manufacturing and process environments.
Service Dynamics

The primary objective of a service company should be to focus on the development a system solution that is uniquely suited to the idiosyncrasies of the client’s business without being tethered by particular product solution offerings. A big part of this is the ability to deploy technologies from appropriate sources using integration and engineering skills to achieve a superior result for the client. Service businesses need to have effective and refined project, personnel, and quality management systems. The growth and effectiveness of these businesses is directly related to adding and managing smart people and this is a unique business proficiency mastered by successful service organizations. Pure service businesses have an advantage of successfully maintaining alliances with a range of product vendors that cannot be logically achieved by product vendors who provide services. This separation positions a pure service business to use best of breed and get the most out of vendors. For comparison, consider you are a smartphone user and the only place to get apps was your phone hardware vendor.

refer to:http://www.automation.com/portals/factory-discrete-automation/can-automation-vendors-serve-two-masters-products-services

Acrosser unveils its ultra slim fanless embedded system with 3rd generation Intel core i processor

Acrosser Technology Co. Ltd, a world-leading industrial and embedded computer designer and manufacturer, announces the new AES-HM76Z1FL embedded system. AES-HM76Z1FL, Acrosser’s latest industrial endeavor, is surely a FIT under multiple circumstances. Innovation can be seen in the new ultra slim fanless design, and its Intel core i CPU can surely cater for those seeking for high performance. Therefore, these 3 stunning elements can be condensed as "F.I.T. Technology." (Fanless, Intel core i, ultra Thin)

The heat sink from the fanless design provides AES-HM76Z1FL with great thermal performance, as well as increases the efficiency of usable space. The fanless design provides dustproof protection, and saving the product itself from fan malfunction. AES-HM76Z1FL has thin client dimensions, with a height of only 20 millimeters (272 mm x183 mm x 20 mm). This differs from most embedded appliances, which have a height of more than 50 millimeters.

The AES-HM76Z1FL embedded system uses the latest technology in scalable Intel Celeron and 3rd generation Core i7/i3 processors with a HM76 chipset. It features graphics via VGA and HDMI, DDR3 SO-DIMM support, complete I/O such as 4 x COM ports, 3 x USB3.0 ports, 8 x GPI and 8 x GPO, and storage via SATA III and Compact Flash. The AES-HM76Z1FL also supports communication by 2 x RJ-45 gigabit Ethernet ports, 1 x SIM slot, and 1 x MinPCIe expansion socket for a 3.5G or WiFi module.

Different from most industrial products that focus on application in one specific industry, the AES-HM76Z1FL provides solutions for various applications through the complete I/O interfaces. Applications of the AES-HM76Z1FL include: embedded system solutions, control systems, digital signage, POS, Kiosk, ATM, banking, home automation, and so on. It can support industrial automation and commercial bases under multiple circumstances.

Key features:
‧Fanless and ultra slim design
‧Support Intel Ivy Bridge CPU with HM76 chipset
‧2 x DDR3 SO-DIMM, up to 16GB
‧Support SATA III and CF storage
‧HDMI/VGA/USB/Audio/GPIO output interface
‧Serial ports by RS-232 and RS-422/485
‧2 x GbE, 1 x SIM, and 1 x MiniPCIe(for3G/WiFi)

Product Information:

http://www.acrosser.com/Products/Embedded-Computer/Fanless-Embedded-Systems/AES-HM76Z1FL/Intel-Core-i3／i7-AES-HM76Z1FL.html

Contact us：

http://www.acrosser.com/inquiry.html

Rugged COM Express: Empowering high-performance automation for an increasingly connected world

What’s needed is a modular embedded computing architecture that addresses these cost and downtime issues. Perhaps the most compelling of the modular architectures available today is COM Express. COM Express provides the requisite computing power for today’s increasingly connected world while also extending the lifespan of the underlying system. As chip technology evolves, users can switch out the module without adverse effect on the underlying hardware and assets – saving time and money. The modularity, simplicity, and reliability of COM Express technology help businesses remain competitive, profitable, and flexible.

Leveraging upgrades in processing power
COM Express-based technology was developed in 1994 by PICMG, a 250-company consortium that develops open specifications for high-performance computing applications. Today, the COM Express form factor comes in four sizes:
Mini: 55 x 84 mm
Compact: 95 x 95 mm
Basic: 95 x 125 mm
Extended: 110 x 155 mm
These different sizes of COM Express modules help businesses to remain competitive by maximizing the performance of critical infrastructure systems in an increasingly connected world in any conceivable industrial application.

The need for improved performance is evidenced by continuous new product introductions by processor manufacturers such as Intel, AMD, and others. Whether it is better threading, more cores, better graphics, lower power, or higher clock speeds, these companies continuously respond to demand for more and faster computing across the board – whether on the desktop or in embedded industrial systems. But replacing a complete subassembly or subsystem each time a compelling new generation of technology becomes available is time-consuming, expensive, and risky. And yet the need to leverage greater levels of processor power and performance is an imperative. Separating the processor module from the underlying carrier means that technology upgrade is painless and affordable.

refer to:http://industrial-embedded.com/articles/rugged-increasingly-connected-world/

Older posts UAV software development using model-based

An in-the-loop testing strategy is often used as itemized below and summarized in Table 2:
1. Simulation test cases are derived and run on the model using Model-In-the-Loop (MIL) testing.
2. Source code is verified by compiling and executing it on a host computer using Software-In-the-Loop (SIL) testing.
3. Executable object code is verified by cross-compiling and executing it on the embedded processor or an instruction set simulator using Processor-In-the-Loop (PIL) testing.
4. Hardware implementation is verified by synthesizing HDL and executing it on an FPGA using FPGA-In-the-Loop (FIL) testing.
5. The embedded system is verified and validated using the original plant model using Hardware-In-the-Loop (HIL) testing.
A requirements-based test approach with test reuse for models and code is explicitly described in ARP4754A, DO-178C, and DO-331, the model-based design supplement to DO-178C.

refer to:
http://mil-embedded.com/articles/transitioning-do-178c-arp4754a-uav-using-model-based-design/

The networking implications of Industry 4.0

John Browett, general manager of the CLPA, addresses what sort of impact the concept of Industry 4.0, and importantly the technologies that underpin it, will have on open industrial networks such as CC-Link.

One of the biggest implications of Industry 4.0 is that the demands placed on industrial networks will increase significantly.

We are facing a potentially exponential increase in the amount of data manufacturing systems will handle as vision systems, batch control, regulatory compliance, quality management and more will mean that the amount of data those networking have to handle is going to rocket.

As a result, we require sufficient bandwidth to allow for this increased use. At present, CC-Link IE is the only industrial automation network technology that can provide a gigabit (1 Gbit/s) of bandwidth, which makes it exceptionally well placed to deal with the demands of Industry 4.0.

To find an example of how data intensive these applications can be one only has to look at the needs of the leading Korean flat panel display manufacturers. Their tolerance for so-called ‘dead pixels’ is almost zero. To put this into perspective, a modern HD screen has 1080 vertical pixels horizontally and 1920 vertically. That’s 2,073,600 pixels on each unit. The manufacturing processes have to check each of these pixels, hundreds of times a day to ensure quality and control yield. It’s easy to see how quickly applications like this will generate vast volumes of data.

As another example, the global automotive industry produces countless different combinations of each vehicle model at an incredible rate. It’s typical for an assembly plant to produce a complete vehicle at a rate of more than one per minute.

Producing these countless different versions at such a pace demands a huge amount of flexibility and a great deal of bandwidth to cope with both the production instructions and the quality control. Most models today have literally thousands of different model configurations depending on customer option choice. To complicate things further, it’s not uncommon for one assembly plant to produce a variety of models. Again, it’s easy to see how this puts huge demands on the networks that deliver this information to the assembly line systems that ensure the correct parts are fitted on the correct vehicle.

As well as the sheer quantity of data that the Internet of Things (IoT) element of Industry 4.0 demands, there is also an interoperability question raised by the M2M (Machine to Machine) issue.

If our factories are full of machines prompting other machines to take action, we had better hope that those machines can talk to each other effectively without any compatibility problems.

In order to make sure that machine X can talk to machine Y we need to ensure that a rigorous conformance testing process is in place. You have to be confident that anything designed for the networking, works with the network.

It’s for this reason that the CLPA devotes a great deal of effort to ensuring that our partners’ products have been tested to the necessary standards. We have created a global network of conformance testing centres that ensure no matter where a partner is located, they have access to convenient local conformance test labs that help speed their time to market.

The evidence is compelling - there is an installed base of over nine million CC-Link devices, but every year the CLPA only discovers a handful of instances of incompatibility.

refer to:http://www.connectingindustry.com/automation/the-networking-implications-of-industry-40.aspx

Embedded computer memory base detection

Standards for XR-DIMM and ECC SODIMM have also contributed to advancing a ready supply of rugged memory products. Furthermore, designers have access to underfill side retainer clips and conformal coating manufacturing options along with advanced testing methodologies to help ensure robust embedded computer designs. The challenges to maintain the highest reliability and availability in rugged embedded system designs will continue, but embedded computer memory module advancements are set to keep pace with these requirements, helping enable OEMs’ continued competitiveness and future innovation.

refer to : http://embedded-computing.com/articles/ruggedization-memory-module-design/

Rackmount 1U Networking Appliance System with 3rd generation Intel Core i processor

ANR-IB751N1/A/B networking appliances.


ANR-IB75N1/A/B is a rackmount platform (440x372x44mm) which can be installed in the 19” rack. It can carry a 3rd generation Intel Core i i3, i5, i7, or Pentium processors to deliver higher efficiency, increased processing throughput, and improved performance on applications. ANR-IB75N1/A/B also comes equipped with a maximum 16GB DDR3 memory and optional 2 or 4 x SFP and 8 x LAN ports. System Integrators can select different configurations for their network appliances. It offers the best P/P ratio in applications like the UTM, IDS/IPS, VPN, Firewall, Anti-Virus, Anti-Spam, RSA gateway, QoS, streaming.
ANR-IB75N1/A/B uses 80 Plus PSU which reduces energy consumption and helps protect the environment. The software and hardware configurable LAN bypass feature also prevents communication breaks due to power loss or system hang-ups. In addition to Intel long life support chipsets, ANR-IB75N1/A/B is designed with a long-term support of 5 years.




Key features:
1. Support 3rd generation Intel Core i LGA1155 i3/i5/i7/Pentium cores processor
2. Intel B75 Chipset
3. DDRIII DIMM x 2, up to 16GB memory.
4. Intel 82576EB x 2 Fiber ports
5. Intel 82574L 10/100/1000Mbps x 8 ports
6. Two pairs LAN ports support bypass feature (LAN 1/2 + LAN 3/4)
7. LAN bypass can be controlled by BIOS and Jumper
8. CF socket, 2.5” HDD x 2, SATA III x 1, SATA II X1
9. Console, VGA (pinhead), USB 3.0 x 2 (2 x external)
10. Support boot from LAN, console redirection
11. Equipped with 80 Plus Bronze PSU to decrease CO2 dissipation and protect our environment
12. LCM module to provide user-friendly interface
13. Standard 1U rackmount size


Product information：
http://www.acrosser.com/Products/Networking-Appliance/Rackmount/ANR-IB75N1／A／B/Networking-Appliance-ANR-IB75N1／A／B.html


Ordering information：
1.ANR-IB75N1: 1U Networking Rackmount Platform with PCH B75, 8 x RJ45 GbE LAN (2 pair bypass)

2.ANR-IB75N1A: 1U Networking Rackmount Platform with PCH B75, 8 x RJ45 GbE LAN (2 pair bypass), and 2 x Fiber ports

3.ANR-IB75N1B: 1U Networking Rackmount Platform with PCH B75, 8 x RJ45 GbE LAN (2 pair bypass), and 4 x Fiber ports
Contact：
http://www.acrosser.com/inquiry.html

About the custom-built approach becomes even less cost effective

In recent years, building, maintaining, and evolving proprietary network systems for telecom-grade applications that are highly available and "always on" have become increasingly prohibitive from the perspective of cost, risk management, time to revenue, and so on. The custom-built approach becomes even less cost effective as Communications Service Providers (CSPs) move toward offering cloud-based services, where they have to compete with non-traditional providers that offer such services on networks built using Commercial Off-The-Shelf (COTS) building blocks.

A change in market dynamics is causing a fundamental paradigm shift in industry's
thinking: Instead of continuing to invest precious Research and Development (R&D) resources and dollars to build expensive, special-purpose proprietary systems with the hope that they will never fail, industry leaders are now assuming that there will be hardware and software failures and thus designing systems and applications that continue to provide end-user service in the presence of such failures. State-of-the-art software and related standards have made significant advances in recent years to support sophisticated schemes and quick implementation of highly available applications and services that can run on relatively inexpensive COTS hardware systems.
1.State of the industry
2.Network Applications Platform
3.Unified Availability
4.Unified Management
5.Extensible architecture
6.Operating environments
7.Vertical Integration
8.Integration Development Kit
9.A final word

refer to : http://xtca-systems.com/articles/engineered-cots-network-systems/

Plug-and-play, it's gaming!

Today HomePlug devices gaming account for more than 90 percent of the world’s broadband-speed power line communications market. The HomePlug standards family includes HomePlug AV for broadband applications such as HD video streams, HomePlug GP for smart grid applications, and soon HomePlug AV2, the next-generation Gigabit-class broadband standard – all fully interoperable with each other and the IEEE 1901 power line standard.

Regarding HDTV support, HomePlug AV enables a broadband-strength network gaming connection via electrical wiring for high-demand applications such as gaming  movies or online gaming. Since the introduction of the HomePlug AV standard back in 2006, its purpose has been to provide high-quality, multistream, entertainment-oriented networking over existing AC wiring within the home. HomePlug AV employs advanced PHY and Medium Access Control (MAC) technologies that provide a 200 Mbps class power line network for video, audio, and data.

refer to:http://industrial-embedded.com/articles/plug-and-play-homeplug-homeplug-powerline-alliance/

Networking systems are under a similar form of stress..

IT managers are under increasing pressure to boost network capacity and performance to cope with the data deluge. Networking systems are under a similar form of stress with their performance degrading as new capabilities are added in software. The solution to both needs is next-generation System-on-Chip (SoC) communications processors that combine multiple cores with multiple hardware acceleration engines.

 

The data deluge, with its massive growth in both mobile and enterprise network traffic, is driving substantial changes in the architectures of base stations, routers, gateways, and other networking systems. To maintain high performance as traffic volume and velocity continue to grow, next-generation communications processors combine multicore processors with specialized hardware acceleration engines in SoC ICs.

1.Networks under increasing stress
2. Moore’s Law not keeping pace
3. Hardware acceleration necessary, but …
4.Next-generation multicore SoCs

refer:http://embedded-computing.com/articles/next-generation-architectures-tomorrows-communications-networks/

Innovation driven by electronics

 

High-end electronics provide drivers and passengers with in-car navigation and entertainment and information delivered over a wireless network. In fact, many car buyers today care more about the infotainment technologies embedded in the dashboard than what's under the hood. This phenomenon is requiring additional storage space for rich multimedia data and advanced software and applications and is driving an explosive growth of both volatile and nonvolatile memories. Embedded multimedia cards are helping meet this demand in today's memory-hungry automotives.

 

The automotive market is moderately but steadily growing. Global car sales rose 6 percent year-on-year in the first half of 2012, despite the ongoing headwinds associated with the sovereign debt problems in Western Europe and some moderation in the pace of global economic activity. Global sales of passenger cars and light commercial vehicles are expected to grow from 78 million units in 2011 to more than 100 million units in 2018. In a recent study, Gartner confirmed that electronics are playing a major role in the advancement of automotive technology. Electronic content in cars has been steadily increasing since the first digital engine control modules were introduced in the ’80s.
Today, microelectronics enable advanced safety features, new information and entertainment services, and greater energy efficiency. The electric/electronic share of value added to a state-of-the-art vehicle is already at 40 percent for traditional, internal combustion engine cars and jumps as high as 75 percent for electric or hybrid electric vehicles. This trend will accelerate as advances in semiconductor technology continue to drive down the cost of various electronic modules and subsystems.
Infotainment is one of the key megatrends fueling the pervasiveness of microelectronics in cars. Users want to be connected and conveniently access their personal content anywhere, anytime, on all of their devices. The vehicle becomes just another node in the network, an extension of the user’s digital and social lifestyle (see this article’s lead-in photo). A “connected” car is also more comfortable, safer, and energy efficient, having early access to important information such as weather reports, traffic jams, or road accidents. According to a recent study, 60 percent of new cars will be connected by 2017. Given this scenario, consumer electronic trends are dictating features in the car, and the innovation cycle time is becoming shorter and shorter. Meanwhile, a key to this automotive infotainment innovation is the system’s enabler: memory.

Refer:
http://embedded-computing.com/articles/automotive-industry-innovation-driven-electronics/

The competitive market for smart

 

The competitive market for smart, connected devices is heating up, which requires OEMs to stay focused on differentiating their products and getting to market quickly. ARM-based building blocks are enabling OEMs to reallocate the resources needed to find, install, program, and troubleshoot drivers or debug hardware and concentrate instead on their core competencies. With prevalidated platforms that are fully configured and tested to deliver the required interoperability, compatibility, and functionality, OEMs can focus on application development and reuse existing application-specific software on a flexible hardware framework.

It is a dynamic time in the embedded market, as processors and software advancements are breaking down the barriers that once limited the implementation of various computing platforms. In conjunction with these advancements, embedded computing board and module suppliers are continually enhancing their platform portfolios to take advantage of the performance, interface, functionality, and power improvements available with next-generation processor architectures.
Refer:
http://embedded-computing.com/articles/modular-scalability-smart-connected-devices/#at_pco=cfd-1.0

Intel 3rd Generation Core i7/i5 and Celeron processors AIV-HM76V0FL

Industrial PC, gaming platform, networking appliance

AIV-HM76V0FL features Intel HM76 mobile chipset and FCPGA 988 socket for 3rd generation Core i mobile computer platform. AIV-HM76V0FL adopts Acrosser’s expertise of design for in-vehicle applications. These designs include smart power management, high efficient thermal module, and diversity of integrated communication technology such as 4 USB 3.0, CAN bus, Wi-Fi, 3.5G wireless WAN, Bluetooth and GPS.

The smart power management subsystem enables user to define the power on and off sequences through software interface or BIOS setting to meet any requirement of in-vehicle applications.

AIV-HM76V0FL Features
‧ FCPGA 988 socket support Intel 3rd Generation Core i7/i5 and Celeron processors up to 45W i7-3820QM
‧ Fanless thermal design and anti-vibration industrial design
‧ HDMI/DVI/VGA video outputs
‧ Combo connector for Acrosser’s In-Vehicle monitor
‧ 4 external USB 3.0 ports
‧ CAN bus 2.0 A/B
‧ Wi-Fi, Bluetooth, 3.5G, GPS
‧ One-wire (i-Button) interface
‧ 9-32 VDC power input
‧ -20 to 60 degree C operating temperature

Embedded computer Intel Atom Chipset with PCI and PCIe Expansion Slot

Acrosser Technology Co. Ltd, global professional industrial embedded computer manufacturer.

AR-ES6003FL, a fanless embedded system with Intel Atom D525 / D425 which is onboard solution and fanless design. It supports DDR3 memory and maximum capacity is 4GB. Based on embedded concept, AR-ES6003FL has variety IO like 4 x serial port, 6 x USB, 2 x GbE and PCI Express expansion. It offers the CF socket that embedded customers used to use, 2 x SATA interface and 1 x disk bay for the customer has large storage capacity request.

Embedded computers ,gaming platform ,Console server

Acrosser offers two kinds of expansion cards as default, one is with 2 x PCI Express x1 slots and another is with 1 x PCI and 1 x PCI Express x1. For OEM/ODM request, we can offer maximum 2 x PCI and 2 x PCI Express x1 slots.

The following is features and specifications for AR-ES6003FL:
‧CPU: Onboard Intel Atom D525 / D425
‧Memory: 2 x SO-DIMM DDR3 up to 4GB
‧Storage: 2 x SATA, 1 x CF
‧Display: 1 x VGA, 1 x 18-bit LVDS (Pin header)
‧Networking: 2 x Giga LAN
‧USB: 6 x USB2.0 (4 x external, 2 x internal)
‧Serial: 3 x RS-232 (DB9), 1 x RS-232/422/485 (DB9, switch selectable)
‧Power: 12V single voltage input (Terminal block)
‧Dimension: 280mm x 210mm x 127mm
‧Operating Temperature: 32 to 131 deg. F (0 to 55 deg. C)
‧Operating System Support: Windows XP, Windows 7, Fedora 14, Ubuntu 10

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From:
http://www.intel.com/content/www/us/en/processors/core/core-processor-family.html