Standards for XR-DIMM and ECC SODIMM have
also contributed to advancing a ready supply of rugged memory products.
Furthermore, designers have access to underfill side retainer clips and
conformal coating manufacturing options along with advanced testing methodologies
to help ensure robust embedded computer designs. The challenges to maintain the highest
reliability and availability in rugged embedded system designs will continue,
but embedded computer memory module advancements are set to keep pace with these requirements,
helping enable OEMs’ continued competitiveness and future innovation.